Semiconductor Processing Technicians
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
- Tasks
- 20 tasks8 core, 12 supplemental
- Family
- ProductionOne of its 114 occupations
- Code
- 51-9141.00SOC 2018: 51-9141
What the work is made of
8 core tasks and 12 supplemental, each quoted as published, with the survey it came from.
Core: central to the jobSupplemental: done by some, not all
- Task 1. Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.Core taskTask 12573Rated by 90 people who do the job, December 2006
- Task 2. Maintain processing, production, and inspection information and reports.Core taskTask 12574Rated by 88 people who do the job, December 2006
- Task 3. Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.Core taskTask 12575Rated by 90 people who do the job, December 2006
- Task 4. Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.Core taskTask 12576Rated by 91 people who do the job, December 2006
- Task 5. Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.Core taskTask 12577Rated by 88 people who do the job, December 2006
- Task 6. Load and unload equipment chambers and transport finished product to storage or to area for further processing.Core taskTask 12578Rated by 91 people who do the job, December 2006
- Task 7. Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.Core taskTask 12579Rated by 89 people who do the job, December 2006
- Task 8. Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.Core taskTask 12580Rated by 91 people who do the job, December 2006
- Task 9. Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.Supplemental taskTask 12581Rated by 91 people who do the job, December 2006
- Task 10. Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.Supplemental taskTask 12582Rated by 89 people who do the job, December 2006
- Task 11. Load semiconductor material into furnace.Supplemental taskTask 12583Rated by 91 people who do the job, December 2006
- Task 12. Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.Supplemental taskTask 12584Rated by 89 people who do the job, December 2006
- Task 13. Count, sort, and weigh processed items.Supplemental taskTask 12585Rated by 90 people who do the job, December 2006
- Task 14. Calculate etching time based on thickness of material to be removed from wafers or crystals.Supplemental taskTask 12586Rated by 89 people who do the job, December 2006
- Task 15. Inspect equipment for leaks, diagnose malfunctions, and request repairs.Supplemental taskTask 12587Rated by 90 people who do the job, December 2006
- Task 16. Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.Supplemental taskTask 12588Rated by 90 people who do the job, December 2006
- Task 17. Stamp, etch, or scribe identifying information on finished component according to specifications.Supplemental taskTask 12589Rated by 91 people who do the job, December 2006
- Task 18. Scribe or separate wafers into dice.Supplemental taskTask 12591Rated by 89 people who do the job, December 2006
- Task 19. Connect reactor to computer, using hand tools and power tools.Supplemental taskTask 12592Rated by 89 people who do the job, December 2006
- Task 20. Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.Supplemental taskTask 12595Rated by 90 people who do the job, December 2006
Where this comes from
Quoted from the U.S. Department of Labor, and credited. Nothing on this page is written by us.
How we copy and credit sources- Published byO*NET 29.0, U.S. Department of LaborEmployment and Training Administration
- ClassificationStandard Occupational Classification 2018, 51-9141
- LicenseCC BY 4.0Free to copy and reuse, with credit
- Changed by usNothing.
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